Roop Mahajan

Lewis A. Hester Chair in Engineering

(540) 231-6876
410H Kelly Hall- 0193
325 Stanger Street
Blacksburg, VA 24061
mahajanr@vt.edu

Education

  • Ph.D., Mechanical Engineering, Cornell University, 1977
  • M.S., Mechanical Engineering, Punjab Engineering College, 1969
  • B.S., Mechanical Engineering, Punjab Engineering College, 1964
ROOM

410H Kelly Hall- 0193 Marker-48

LEARN MORE ABOUT ROOP

  • Research

    • Advanced Electronic Cooling
    • Two-Phase Flows
    • Porous Media
    • Synthesis and application of graphene and its derivatives and composites
    • Biomedical Devices
    • Emerging and Black Swan Technologies
    • Cross-cutting technologies for sustainable communities
    • Next generation engineering curriculum

  • Professional Affiliations

  • Publications

  • Professional History

    • 2006 – Present, Virginia Tech, Institute for Critical Technology and Applied Science (ICTAS), Director & Kewis A. Hester Chair in Engineering
    • 1991 – 2006, University of Colorado at Boulder, Department of Mechanical Engineering, Professor
    • 2001 -2002, University of Colorado at Boulder, College of Engineering and Applied Science, Interim Dean
    • 1992 – 2006, Optical and Digital Electronics (CAMPmode), Center for Advanced Manufacturing and Packaging for Microwave, Founding Director
    • 1999 – 2006, MicroElectronic Devices in cardiovascular Applications (MEDICA), Founding Co-Director
    • 1979 – 1991, AT&T Bell Laboratories, Thermal and Computational Engineering, Research Leader/Supervisor
    • 1976 – 1979, AT&T Engineering Research Center, Thermal Energy Studies Department, Member Research Staff

  • Awards & Honors

    • Recipient of the 75th Anniversary Medal of the ASME Heat Transfer Division, 2013
    • Fellow, Punjab Academy of Sciences, 2008
    • Ralph Coats Roe Medal Award for lifelong contributions in communicating to the public the potential of engineering research for the betterment of society, 2007
    • ASME Charles Russ Richards Memorial Award for outstanding achievement in mechanical engineering 20 years or more following graduation, 2003
    • ASME Heat Transfer Memorial Award, for outstanding contributions in Science and Practice of Heat Transfer, 2002
    • Subaru Educator of the Year Award, 2002
    • Boulder Faculty Assembly Award for Excellence in Research, Scholarship and Creative Work, 1998-1999
    • Bell Labs Fellow, for outstanding technical contributions in advancing the manufacturing science of the thermally-based processes of condensation soldering and silicon epitaxial crystal growth in actual manufacturing practice, 1989
    • ASME Fellow, 1997
    • AT&T Technical Journal Great Boss Award, 1988
    • The Journal of Electronic Packaging Peter A. Engel Best Paper Award, 1996

  • Professional Leadership

    • 2011-Present, Editorial Board Member, International Journal of Engineering Sciences and Management
    • 2008-2010, Editor-in-Chief, CRC Press Advanced Series in Bioengineering
    • 2004-2008, Co-Editor-in-Chief, CRC Press Mechanical Engineering Series
    • 1999-2000, Editor-in-Chief, International Journal of Microelectronics Packaging and Manufacturing
    • 1997-2000, Associate Technical Editor, ASME Journal Heat Transfer
    • 1994-2006, Associate Editor, Gordon and Breach book series on Electronic Packaging
    • 1994-2004, Member Editorial Board Journal of Electronics Manufacturing
    • 2004-2006, Member, Scientific Secretariat, ICS/UNIDO (International Center for Science and High Technology/United Nations Industrial Development Organization)
    • 2004-2006, Founding Member, CNTI (Colorado Nanotech, Inc., Member Board of Directors)
    • 2005, Member Board of Directors of CNTA (Colorado Nanotechnology Association)
    • 1996-2006, Member, National Steering Committee on Electronic Packaging Research and Education for the 21st Century
    • Reviewer for a number of journals and agencies to include the National Science Foundation, Applied Mechanics Reviews, Journal Heat & Mass Transfer, IEEE Transactions on CPMT, AIAA Thermophysics and Heat Transfer, Research Grants Council-Hong Kong etc.